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US 2019/0198448 A1Published application
Anisotropically conductive elastic adhesive films in semiconductor device packages and methods of assembling same
AssigneeIntel IP Corporation
InventorsSonja Koller, Georg Seidemann, Bernd Waidhas
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Abstract
A semiconductor device package includes an anisotropically conductive flexible film including a plurality of electrically conductive corridors. The film is coupled to make electronic and also heat-transfer contact to a semiconductive device.
Claims25
A semiconductor device package, comprising:
- an anisotropically conductive flexible film including a plurality of electrically conductive corridors disposed therein;
- a semiconductor package substrate coupled to the anisotropically conductive flexible film;
- and
- a semiconductive device, wherein at least one of the semiconductor package substrate and the semiconductive device is in direct contact with the anisotropically conductive flexible film.
1 more element
A process of assembling a semiconductor device package, comprising:
- assembling an anisotropically conductive flexible film to at least one of:
- a bond pad on a semiconductor package substrate;
- a bond pad on a semiconductive device;
- and
- a heat sink;
- bonding the anisotropically conductive flexible film under conditions to form at least one of an electronic connection and a heat-transfer conductive channel.
3 more elements
A computing system, comprising:
- an anisotropically conductive flexible film including a plurality of electrically conductive corridors disposed therein;
- a semiconductor package substrate coupled to the anisotropically conductive flexible film;
- a semiconductive device, wherein at least one of the semiconductor package substrate and the semiconductive device is in direct contact with the anisotropically conductive flexible film;
- and
- wherein the semiconductive device is coupled with memory and a chipset.
2 more elements
Dependencies are inferred from the claim text.