Semiconductor devices having electrically and optically conductive vias, and associated systems and methods
AssigneeMicron Technology, Inc.
InventorsEiichi Nakano, Mark E. Tuttle
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Abstract
Semiconductor devices having one or more vias filled with a transparent and electrically conductive material are disclosed herein. In one embodiment, a semiconductor device includes a first semiconductor die stacked over a second semiconductor die. The first semiconductor die can include at least one via that is axially aligned with a corresponding via of the second semiconductor die. The vias of the first and second semiconductor dies can be filled with a transparent and electrically conductive material that both electrically and optically couples the first and second semiconductor dies.
Claims20
A semiconductor device, comprising:
- a first semiconductor die;
- a second semiconductor die positioned adjacent to the first semiconductor die;
- a via extending at least partially through the first and second semiconductor dies;
- and
- an optically and electrically conductive material in the via, wherein the optically and electrically conductive material (a) optically couples the first and second semiconductor dies and (b) electrically couples the first and second semiconductor dies.
A semiconductor die, comprising:
- a substrate having integrated circuitry;
- a via extending at least partially through the substrate;
- an optically and electrically conductive material in the via;
- and
- an optical component for receiving and/or transmitting optical signals, wherein the optical component is (a) optically coupled to the optically and electrically conductive material in the via and (b) electrically coupled to the integrated circuitry.
A method of forming a semiconductor device, the method comprising:
- positioning a first semiconductor die adjacent to a second semiconductor die to at least partially align a first via of the first semiconductor with a second via of the second semiconductor die;
- electrically coupling the first semiconductor die to the second semiconductor die via an optically and electrically conductive material disposed in the first and second vias;
- and
- optically coupling the first semiconductor die to the second semiconductor die via the optically and electrically conductive material.
Dependencies are inferred from the claim text.