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AssigneeInternational Business Machines Corporation
InventorsDaniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method. The sacrificial trace structure having a geometry for the interconnect. The method continuous with forming a continuous seed metal layer on the sacrificial trace structure; and removing the sacrificial trace structure, wherein the continuous seed metal layer remains. An interconnect metal layer may be formed on the continuous seed layer. A dielectric material may then be formed on the interconnect metal layer to encapsulate a majority of the interconnect metal layer, wherein ends of the interconnect metal layer are exposed through one surface of the dielectric material to provide an interconnect extending into a dielectric material.
An interposer structure comprising:
An interposer structure comprising:
An interposer structure comprising:
Dependencies are inferred from the claim text.