Chip on Film and a Display Device Having Thereof
AssigneeLG Display Co., Ltd.
InventorsDaekyung KIM, Wansik LIM, Jaesung JEON, Ri YU, Cheolho LEE, Joohye KANG
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Abstract
A chip on film according to the present disclosure includes a base film, a plurality of signal wirings on an upper surface and a lower surface of the base film to transmit a signal in two signal paths, a driving unit on one surface of the upper surface and the lower surface of the base film, a first pad and a second pad on one surface of the upper surface and the lower surface of the base film, and a plurality of through holes between the first pad and the second pad and electrically connect to the signal wiring.
Claims11
A chip on film, comprising:
- a base film;
- a plurality of signal wirings on an upper surface and a lower surface of the base film to transmit a signal through two signal paths;
- a driving unit on one surface of the upper surface and the lower surface of the base film;
- a first pad and a second pad on one surface of the upper surface and the lower surface of the base film;
- and
- a plurality of through holes between the first pad and the second pad to electrically connect the signal wirings.
A display device comprising:
- a display panel including a display region and a pad region outside the display region;
- and
- a chip on film attached to the pad region, the chip on film comprising:
- a base film,
- a plurality of signal wirings on an upper surface and a lower surface of the base film to transmit a signal through two signal paths,
- a driving unit on one surface of the upper surface and the lower surface of the base film,
- a first pad and a second pad on one surface of the upper surface and the lower surface of the base film, and
- a plurality of through holes between the first pad and the second pad to electrically connect the signal wirings.
Dependencies are inferred from the claim text.