Semiconductor packaging structure with antenna assembly

A semiconductor packaging structure with an antenna assembly, comprising:

• a substrate having a first surface and a second surface opposite to the first surface, wherein at least one via hole through the first surface and the second surface is formed in the substrate;
• a rewiring layer located on the first surface of the substrate;
• a plurality of metal bumps, located on a surface of the rewiring layer and electrically connected to the rewiring layer;
• a semiconductor chip, located on the surface of the rewiring layer and electrically connected to the rewiring layer, wherein a space is configured between the semiconductor chip and each of the plurality of metal bumps;
• a conductive column, filling in the at least one via hole;
• a bottom filling layer, filling up a gap between the semiconductor chip and the rewiring layer;
• a polymer layer, located on the surface of the rewiring layer, surrounding the plurality of metal bumps, the bottom filling layer and the semiconductor chip, but exposing a top part of each of the plurality of metal bumps and a top part of the semiconductor chip;
• and
• an antenna assembly, located on the second surface of the substrate, wherein the antenna assembly is electrically connected to at least one of the plurality of metal bumps through the conductive column and the rewiring layer.