Electronic component-incorporating substrate and sheet substrate

A sheet substrate, comprising:

• a plurality of electronic component-incorporating substrates;
• and
• a cutting region of the sheet substrate, the cutting region being defined surrounding the plurality of electronic component-incorporating substrates and between adjacent ones of the plurality of electronic component-incorporating substrates, wherein
• each of the electronic component-incorporating substrates includes
• a lower substrate,
• an electronic component mounted on the lower substrate,
• an upper substrate arranged above the electronic component and the lower substrate,
• a substrate connecting member arranged between the lower substrate and the upper substrate to connect the lower substrate and the upper substrate, and
• an encapsulation resin filling a gap between the lower substrate and the upper substrate to encapsulate the electronic component and the substrate connecting member, wherein
• the upper substrate includes a substrate body and a solder resist layer arranged on a lower surface of the substrate body, and
• the solder resist layer includes a groove extending in the solder resist layer from a directly-above region, located directly above at least the electronic component, to the cutting region.