Fan-out semiconductor package

A fan-out semiconductor package comprising:

• a frame including a plurality of insulating layers, a plurality of wiring layers disposed on the plurality of insulating layers, and a plurality of connection via layers penetrating through the plurality of insulating layers and electrically connecting the plurality of wiring layers to each other, and having a recess portion and a stopper layer disposed on a bottom surface of the recess portion;
• a semiconductor chip disposed in the recess portion and having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface and disposed on the stopper layer;
• first metal bumps disposed on the connection pads of the semiconductor chip;
• an encapsulant covering at least portions of each of the frame, the semiconductor chip, and the first metal bumps and filling at least portions of the recess portion;
• a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the plurality of wiring layers of the frame and the connection pads of the semiconductor chip to each other;
• and
• a first blocking structure disposed on walls of the recess portion to surround side surfaces of the semiconductor chip.