Power module with built-in power device and double-sided heat dissipation and manufacturing method thereof

A manufacturing method for a power module, comprising:

• providing a first base plate, wherein the first base plate comprises a first organic insulating base material and a first electrical insulating heat dissipation body embedded in the first organic insulating base material, a first metal layer thermally connected to a first side of the first electrical insulating heat dissipation body is formed at a first surface side of the first base plate, a second metal layer thermally connected to a second side of the first electrical insulating heat dissipation body is formed at a second surface side opposite to the first surface side of the first base plate, and the second metal layer is patterned;
• providing a heat dissipation assembly, wherein the heat dissipation assembly comprises a second electrical insulating heat dissipation body, a second heat dissipation metal layer thermally connected to a first side of the second electrical insulating heat dissipation body, and a fourth metal layer thermally connected to a second side of the second electrical insulating heat dissipation body, and the fourth metal layer is formed with a concave power device accommodating space;
• soldering the heat dissipation assembly and a power device to the second metal layer and overlapping the heat dissipation assembly and the first electrical insulating heat dissipation body with each other in a thickness direction of the first base plate, wherein the power device is placed in the concave power device accommodating space, and two opposite surfaces of the power device are respectively provided with a first electrode and a second electrode;
• establishing a first electrical connection between the first electrode at a first surface of the power device and the second metal layer;
• establishing a second electrical connection between the second electrode at a second surface of the power device and the fourth metal layer;
• establishing a third electrical connection between the fourth metal layer and the second metal layer;
• sequentially layering a second organic insulating base material with a second through window and a second base material metal layer disposed on the second organic insulating base material on the first base plate, wherein the second organic insulating base material comprises a prepreg and an organic insulating medium layer sequentially and alternately arranged between the first base plate and the second base material metal layer, the heat dissipation assembly is embedded in the second through window;
• performing hot pressing after the power module is layered with the second organic insulating base material;
• sequentially forming a second base copper layer and a second electroplated thickened copper layer on a surface of an outer side of the second base material metal layer and the heat dissipation assembly, wherein the second base material metal layer, the second base copper layer, the second electroplated thickened copper layer, and the second heat dissipation metal layer constitute a third metal layer;
• and
• wherein a second base plate comprises the second organic insulating base material and the second electrical insulating heat dissipation body embedded in the second organic insulating base material, the first electrical insulating heat dissipation body and the second electrical insulating heat dissipation body overlap with each other in the thickness direction of the first base plate, the third metal layer thermally connected to the first side of the second electrical insulating heat dissipation body is formed at an outer side of the second base plate.