Device module embedded with switch chip and manufacturing method thereof

A method for manufacturing a device module embedded with switch chip, comprising:

• providing a double-sided circuit board, wherein a first surface of the double-sided circuit board is provided with a first pad, a second surface opposite to the first surface is provided with a second pad, the first pad and the second pad are electrically connected by an electric-conductive via hole, a plurality of pins of a switch chip are soldered to the first pad, and an electric insulating heat dissipation body is soldered to a side of the switch chip opposite to a side of the plurality of pins;
• wherein the electric insulating heat dissipation body comprises a ceramic core and a plurality of heat dissipation metal layers located at both sides of the ceramic core in a thickness direction of the double-sided circuit board;
• sequentially layering an organic insulating base material having a through window and a base metal layer disposed on the organic insulating base material on the double-sided circuit board, wherein the organic insulating base material comprises alternately disposed prepregs and organic insulating medium layers, and the switch chip and the electric insulating heat dissipation body are embedded in the through window;
• hot-pressing the device module after the device module is layered with the organic insulating base material;
• forming a copper-clad layer on a surface of the device module away from the double-sided circuit board by using a chemical plating process and an electroplating process;
• and
• soldering a plurality of pins of the energy storage device to the second pad.