Heat radiating plate-lined ceramics substrate
AssigneeKabushiki Kaisha Toshiba
InventorsMasahiro Yokota, Akihiko Happoya
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Abstract
According to one embodiment, a heat radiating plate-lined ceramic substrate includes a first bonding layer, a plating layer and a heat radiating plate provided in order on the ceramic substrate. The first bonding layer is formed from a molecular bonding material containing a ceramic substrate fixing portion and a plating support portion. The ceramic substrate fixing portion and the first bonding layer are bonded together by the ceramic substrate fixing portion and the plating layer and the first bonding layer are bonded together by the plating support portion.
Claims18
A heat radiating plate-lined ceramic substrate comprising:
- a ceramic substrate;
- a first bonding layer on the ceramic substrate;
- a plating layer on the first bonding layer;
- and
- a heat radiating plate on the plating layer,
- wherein the first bonding layer comprises a molecular bonding material containing a ceramic substrate fixing portion and a plating support portion,
- wherein the ceramic substrate and the first bonding layer are bonded together by the ceramic substrate fixing portion, and
- wherein the heat radiating plate and the first bonding layer are bonded together by the plating support portion.
Dependencies are inferred from the claim text.