Electronic assembly with a direct bonded copper substrate
AssigneeDeere & Company
InventorsCHRISTOPHER J. SCHMIT, RICHARD E. WAINWRIGHT
Life of this patent
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Abstract
A metallic island is disposed between a first metallic bus and a second metallic bus. The first metallic strip is isolated from the metallic island by a first dielectric barrier. At least a parallel portion of the first metallic strip is generally parallel to the first metallic bus, the second metallic strip isolated from the second metallic bus by a second dielectric barrier. Each first semiconductor terminals that are coupled to the first metallic bus and to the metallic island. Each second semiconductor has terminals coupled to the metallic island and to the second metallic bus.
Claims22
An electronic assembly comprising:
- a direct copper bonded dielectric substrate comprising a dielectric layer;
- a first metallic bus overlying the dielectric layer, the first metallic bus having a bus width;
- a second metallic bus overlying the dielectric layer and generally parallel to the first metallic bus, where the first metallic bus and the second metallic bus are associated with direct current terminals;
- a metallic island between the first metallic bus and the second metallic bus;
- a first metallic strip having a strip width that is less than the bus width, the first metallic strip isolated from the metallic island by a first dielectric barrier;
- a second metallic strip having the strip width that is less than the bus width, the second metallic strip isolated from the second metallic bus by a second dielectric barrier;
- a set of one or more first semiconductors, each first semiconductor having at least one primary terminal and a secondary terminal, the at least one primary terminal coupled to the first metallic bus and the secondary terminal coupled to the metallic island;
- and
- a set of one or more second semiconductors, each second semiconductor having at least one primary terminal and a secondary terminal, the at least one primary terminal coupled to the metallic island and the secondary terminal coupled to the second metallic bus.
An electronic assembly comprising:
- a direct copper bonded dielectric substrate comprising a dielectric layer;
- a first metallic bus overlying the dielectric layer, the first metallic bus having a bus width;
- a second metallic bus overlying the dielectric layer and generally parallel to the first metallic bus, where the first metallic bus and the second metallic bus are associated with direct current terminals;
- a metallic island between the first metallic bus and the second metallic bus, the metallic island comprising an output terminal pad;
- a first metallic strip having a strip width that is less than the bus width, the first metallic strip isolated from the metallic island by a first dielectric barrier;
- a second metallic strip having the strip width that is less than the bus width, the second metallic strip isolated from the second metallic bus by a second dielectric barrier;
- a set of one or more first semiconductors, each first semiconductor having at least one primary terminal and a secondary terminal, the at least one primary terminal coupled to the first metallic bus and the secondary terminal coupled to the metallic island;
- a set of one or more second semiconductors, each second semiconductor having at least one primary terminal and a secondary terminal, the at least one primary terminal coupled to the metallic island and the secondary terminal coupled to the second metallic bus;
- and
- a current shunt resistor overlies a portion of the metallic island or the output terminal pad associated with an output signal of the electronic assembly, the current shunt resistor having a central bore and providing an output terminal for the output signal.
Dependencies are inferred from the claim text.