Thermally insulating composition and electronic devices assembled therewith

An electronic article of manufacture comprising:

• A housing comprising at least one substrate having an interior surface and an exterior surface;
• A layer of a thermally insulating composition comprising phase change material and thermally insulating elements dispersed therein dispersed upon a carrier substrate, which layer is disposed on at least a portion of the interior surface of the at least one substrate of the housing;
• and
• At least one semiconductor package comprising an assembly comprising at least one of
• I.
• a semiconductor chip;
• a heat spreader;
• and
• a thermal interface material therebetween, or
• II.
• a heat spreader;
• a heat sink;
• and
• a thermal interface material therebetween.