Microelectronics package with an integrated heat spreader
AssigneeIntel Corporation
InventorsNicholas Neal, David W. Mendel, Chandra M. Jha, Kelly P. Lofgreen
Life of this patent
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Abstract
Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a first die, a second die, and an integrated heat spreader. The integrated heat spreader may include a first surface. The first surface may define a first indentation located in between the first die and the second die.
Claims30
A microelectronics package comprising:
- a first die;
- a second die;
- a third die;
- and
- an integrated heat spreader, the integrated heat spreader including a first surface, the first surface defining:
- a first indentation located in between the first die and the second die, and
- a second indentation located in between the third die and the first die and the second die.
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A method of manufacturing a microelectronics package, the method comprising:
- attaching a first die, a second die, and a third die to a substrate;
- forming a first indentation in a first surface of an integrated heat spreader;
- forming a second indentation in the integrated heat spreader;
- and
- attaching the integrated heat spreader to the first die, the second die, and the third die such that:
- the first indentation is located in between the first die and the second die, and
- the second indentation is located in between the third die and the first die and the second die.
-18. (canceled)
-25. (canceled)
A microelectronics package comprising:
- a first die;
- a second die;
- a third die;
- and
- an integrated heat spreader, the integrated heat spreader including a first surface, the first surface defining:
- a first indentation located in between the first die and the second die,
- a second indentation located in between the first die and the third die, and
- a third indentation located in between the second die and the third die.
A method of manufacturing a microelectronics package, the method comprising:
- attaching a first die, a second die, and a third die to a substrate;
- forming a first indentation in a first surface of an integrated heat spreader;
- forming a second indentation and a third indentation in the integrated heat spreader;
- and
- attaching the integrated heat spreader to the first die, the second die, and the third die such that:
- the first indentation is located in between the first die and the second die,
- the second indentation is located in between the first die and the third die, and
- the third indentation is located in between the second die and the third die
Dependencies are inferred from the claim text.