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US 2019/0198415 A1Published application
Semiconductor package and a method of manufacturing the same
AssigneeMagnaChip Semiconductor, Ltd.
InventorsJae Sik CHOI, Dong Seong OH, Si Hyeon GO
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Abstract
A method to manufacture a semiconductor package includes: preparing a metal substrate; attaching semiconductor dies to the metal substrate at an interval; attaching a bonding film to the semiconductor dies; applying a mold material on the semiconductor dies and the metal substrate, and curing the mold material to form a mold member; grinding the mold member and the metal substrate to a thickness; removing the bonding film; attaching a redistribution layer to the semiconductor dies; and cutting between the semiconductor dies.
Claims6
A semiconductor package, comprising:
- a semiconductor die comprising a first surface and a second surface;
- a redistribution layer attached to the first surface and extending outside of an outer periphery of the semiconductor die;
- a metal substrate attached to the second surface;
- and
- a mold member surrounding sides of the semiconductor die, and disposed on the metal substrate.
2 more elements
Dependencies are inferred from the claim text.