Chip on film package and display device including the same

A chip on film package, comprising:

• a driving integrated circuit chip from which a signal is provided to a display panel for displaying an image;
• and
• a base substrate including:
• a driving integrated circuit region in which the driving integrated circuit chip is disposed on the base substrate,
• a first input region in which a first input wiring through which a first input signal is transmitted to the driving integrated circuit chip from outside the chip on film package is disposed on the base substrate, the first input region disposed at a first side of the driving integrated circuit region,
• second input regions in which a second input wiring through which a second input signal is transmitted to the display panel from outside the chip on film package is disposed on the substrate, the second input regions spaced apart from each other and located at opposing sides of the first input region along the first side of the driving integrated circuit chip region, respectively,
• an output region, in which an output wiring through which an output signal is transmitted from the integrated circuit chip to the display panel is disposed on the base substrate, the output region located between the driving integrated circuit region and each of the second input regions, respectively, and
• a first region, located at a second side of the driving integrated circuit region which is opposite to the first side thereof, the first region being surrounded by the driving integrated circuit region and the output region,
• wherein
• the electrical ground pattern structure is disposed in at least one region among the first input region, the second input region, the output region and the first region of the base substrate, and
• the electrical ground pattern structure includes a plurality of ground patterns including:
• ground patterns inclined in a first direction, and
• ground patterns inclined in a second direction different from the first direction.

A display device, comprising:

• a display panel including a plurality of pixel structures with which an image is displayed by the display panel;
• an external device which generates a plurality of signals for controlling the pixel structures to display the image;
• and
• a chip on film package through which the signals are provided to the display panel from the external device, connected to a first end of the display panel and bendable along a side surface of the display panel;
• and
• wherein the chip on film package includes:
• a driving integrated circuit chip from which an output signal is provided to the display panel from the external device,
• a base substrate including:
• a driving integrated circuit region in which the driving integrated circuit is disposed on the base substrate, and
• a first region at which stress is converged by the base substrate bent along the side surface of the display panel, located at a first side of the driving integrated circuit region;
• and
• an electrical ground pattern structure with which the driving integrated circuit is electrically grounded, on the base substrate in the first region thereof,
• wherein
• the electrical ground pattern structure is connected to a first side of the driving integrated circuit chip which corresponds to the first side of the driving integrated circuit region, and
• the ground pattern structure includes extended from the first side of the driving integrated circuit chip, a plurality of ground patterns including:
• in a first portion of the first region, ground patterns each inclined in a first direction with respect to the first side of the driving integrated circuit chip, and
• in a second portion of the first region which is directly adjacent to the first portion along the first side of the driving integrated circuit chip, ground patterns each inclined in a second direction with respect to the first side of the driving integrated circuit chip, the second direction being different from the first direction.