Semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorsYasuyoshi HORIKAWA, Yoshihiro IHARA, Yoshihiro KITA, Hikaru TANAKA
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Abstract
A semiconductor device includes a flexible wiring substrate. The wiring substrate includes at least two mounting portions and at least one connecting portion. The mounting portions are stacked spaced apart from each other. Each connecting portion is bent to connect two mounting portions that are adjacent in a stacking direction. The semiconductor device further includes at least one semiconductor chip mounted on at least one of the at least two mounting portions and a plurality of conductive connecting members connecting the mounting portions to each other in the stacking direction.
Claims8
A semiconductor device comprising:
- a wiring substrate that has flexibility, wherein the wiring substrate includes
- at least two mounting portions that are stacked spaced apart from each other, and
- at least one connecting portion, each of the at least one connecting portion being bent to connect two of the at least two mounting portions that are adjacent in a stacking direction;
- at least one semiconductor chip mounted on at least one of the at least two mounting portions;
- and
- a plurality of conductive connecting members connecting the at least two mounting portions to each other in the stacking direction.
Dependencies are inferred from the claim text.