Cavity packages
AssigneeInvensas Bonding Technologies, Inc.
InventorsShaowu Huang, Javier A. DeLaCruz, Liang Wang, Rajesh Katkar, Belgacem Haba
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Abstract
An integrated device package is disclosed. The integrated device package can include an integrated device die, an element, a cavity, and an electrical interconnect. The element can have an antenna structure. The element can be attached to a surface of the integrated device. The cavity can be disposed between the integrated device die and the antenna structure. The electrical interconnect can connect the integrated device die and the antenna structure.
Claims35
An integrated device package comprising:
- an integrated device die;
- an element comprising an antenna structure, the element attached to a surface of the integrated device die;
- a cavity disposed between the integrated device die and at least a portion of the antenna structure;
- and
- an electrical interconnect connecting the integrated device die and the antenna structure.
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An integrated device package comprising:
- a package housing comprising a semiconductor material, the package housing comprising:
- an integrated device;
- an antenna structure;
- and
- a cavity disposed between the integrated device and at least a portion of the antenna structure;
- and
- an electrical interconnect connecting the integrated device and the antenna structure.
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A method of manufacturing an integrated device package, the method comprising:
- forming a recess in a semiconductor element comprising an antenna structure;
- and
- bonding the semiconductor element with an integrated device die, wherein the recess is disposed between the antenna structure and the integrated device die.
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Dependencies are inferred from the claim text.