Substrate and package module including the same
AssigneeLingsen Precision Industries, Ltd.
InventorsYu-Shiang CHEN, Chao-Wei YU, Yu-Lin HSIAO, Ming-Te TU
Life of this patent
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Abstract
A substrate includes a substrate body and an interconnection layer disposed on a bearing surface of the substrate body and having an annular portion and a plurality of protrusions extending outward from an outer periphery of the annular portion. A package module is formed by the substrate, a chip mounted on the bearing surface of the substrate body, and a cap enclosing the chip and having a bottom thereof adhered to the interconnection layer of the substrate by an adhesive. By means of the protrusions of the interconnection layer, the bonding area of the adhesive is increased and the spread of the adhesive is effectively concentrated.
Claims8
A substrate comprising:
- a substrate body having a bearing surface;
- and
- an interconnection layer disposed on the bearing surface of the substrate body and having an annular portion and a plurality of first protrusions extending outward from an outer periphery of the annular portion;
- wherein the interconnection layer has a plurality of second protrusions extending inward from an inner periphery of the annular portion, and each of the first protrusions and each of the second protrusions are interlaced with each other.
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Dependencies are inferred from the claim text.