Electrically conductive via(s) in a semiconductor substrate and associated production method

A method of or for producing at least one electrical via (150, 150′) in a substrate (3), the method comprising the following steps:

• producing a protective layer (4) over a component structure (5) which has been produced or is present on a front side (2) of the substrate (3);
• forming at least one contact hole (14, 14′) which extends from a surface of a backside (1) of the substrate (3) to a contact surface (5a) of the component structure (5);
• forming a metal-containing and thus conductive lining (8, 9, 10) in the at least one contact hole (14, 14′) creating a hollow electrically conductive structure (110) in the at least one contact hole (14, 14′);
• and
• applying a passivation layer (11) over the backside (1) of the substrate (3), the passivation layer (11) spanning over the hollow electrically conductive structure (110) for forming the at least one electrical via (150, 150′).