Methods for processing semiconductor dice and fabricating assemblies incorporating same

A method for processing semiconductor dice, the method comprising:

• depositing a film comprising one of a dielectric material and a metal material on a surface of a semiconductor wafer;
• bonding an array of mutually separated semiconductor dice to the film by active surfaces;
• encapsulating sides and back sides of the semiconductor dice with a dielectric molding material;
• exposing the film by etching silicon from an opposing surface of the semiconductor wafer;
• patterning the film to expose bond pads of the semiconductor dice;
• forming an array of redistribution layers over the semiconductor dice in electrical communication with bond pads of associated semiconductor dice;
• and
• singulating redistribution layers and associated semiconductor dice from the arrays.

A method for fabricating a reconstituted wafer, the method comprising:

• forming a film on a surface of a semiconductor wafer;
• securing semiconductor dice to the film in an array of mutually spaced locations;
• covering backs and sides of the semiconductor dice with a dielectric molding material;
• and
• removing material from an opposing surface of the semiconductor wafer to expose the film.