Temporary carrier debond initiation, and associated systems and methods
AssigneeMicron Technology, Inc.
InventorJonathan S. Hacker
Life of this patent
Estimating the term…
Abstract
Systems and methods for debonding a carrier from a semiconductor device are disclosed herein. In one embodiment, a system for debonding a carrier from a semiconductor device includes a support member positioned to carry the semiconductor device and a fluid delivery device having an exit positioned to direct a fluid toward an adhesive layer between the carrier and the semiconductor device. The fluid directed from the fluid delivery device initiates debonding of the carrier from the semiconductor device by weakening or loosening at least a portion of the adhesive. The system further includes a liftoff device configured to releasably engage the carrier and apply a debonding force to the carrier to complete debonding of the carrier from the semiconductor device.
Claims22
A system for debonding a temporary carrier from a semiconductor device, comprising:
- a support member positioned to carry the semiconductor device, the semiconductor device being bonded to a temporary carrier by an adhesive layer;
- a fluid delivery device having an exit positioned to direct a fluid toward the adhesive layer that temporarily bonds a first side of the temporary carrier to the semiconductor device;
- and
- a liftoff device configured to releasably attach to a second side of the temporary carrier and apply a debonding force to the temporary carrier.
A method for debonding a temporary carrier from a semiconductor device, comprising:
- directing a fluid toward an adhesive layer that temporarily bonds the carrier to the semiconductor device to initiate debonding of the carrier from the semiconductor device by loosening at least a portion of the adhesive layer,
- wherein the fluid is directed by a fluid delivery device having an exit positioned to direct the fluid toward only an exposed portion of the adhesive layer;
- and
- debonding the carrier from the semiconductor device by lifting the carrier away from the semiconductor device.
A system for debonding a carrier from a semiconductor device, comprising:
- a support member releasably coupled to a lower surface of the semiconductor device, the semiconductor device being bonded to a temporary carrier;
- a fluid delivery device configured to direct a fluid stream toward an interface between an upper surface of the semiconductor device and a lower surface of the temporary carrier to weaken a bond between the semiconductor device and the temporary carrier;
- and
- a liftoff device having at least one vacuum head configured to releasably attach to an upper surface of the carrier, wherein the liftoff device is configured to lift the temporary carrier away from the semiconductor device after the fluid delivery device weakens the bond between the semiconductor device and the temporary carrier.
Dependencies are inferred from the claim text.