Semiconductor packaging apparatus and method of manufacturing semiconductor device using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJUNGHYUN CHO, SANG-GEUN PARK, DONGSEOK BAEK, JAEHYUK CHOI
Life of this patent
Estimating the term…
Abstract
A semiconductor packaging apparatus and methods of manufacturing semiconductor devices using the same. The semiconductor packaging apparatus includes a process unit, and a controller associated with the process unit. The process unit includes a bonding part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate, a cooling part that cools the bonded substrate, and a detection part in the cooling part and configured to detect a defect of the bonded substrate. The controller is configured to control the process unit using data obtained from the detection part.
Claims20
A semiconductor packaging apparatus, comprising:
- a process unit including a bonding part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate;
- a cooling part that cools the bonded substrate;
- and
- a detection part arranged in the cooling part that is configured to detect a whether the bonded substrate has a defect;
- and
- a controller connected to the process unit, the controller is configured to control the process unit using data obtained from the detection part;
- and
- wherein the defect detected by the detection part includes at least one of a surface defect of the bonded substrate or a defect in the bonding of the semiconductor substrate and the carrier substrate.
A semiconductor packaging apparatus, comprising:
- bonding a part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate;
- a cooling part that performs a cooling process cooling the bonded substrate;
- and
- a detection part arranged in the cooling part and configured to detect a defect of the bonded substrate while the cooling process is performed.
A method of manufacturing a semiconductor device, the method comprising:
- forming a bonded substrate by bonding a carrier substrate to a semiconductor substrate in a bonding part of a semiconductor packaging apparatus;
- performing a cooling process that cools the bonded substrate;
- and
- detecting, by a detection part of the semiconductor packaging apparatus, a defect of the bonded substrate during the cooling process.
Dependencies are inferred from the claim text.