Integrated circuit controlled ejection system (icces) for massively parallel integrated circuit assembly (mpica)
AssigneeMatrics2, Inc.
InventorsMichael R. Arneson, William R. Bandy
Life of this patent
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Abstract
Methods, systems, and apparatuses are described for integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA). A unique Integrated Circuit (IC) die ejection head assembly system is described, which utilizes Three-Dimensional (3D) printing to achieve very high resolution manufacturing to meet the precision tolerances required for very small IC die sizes.
Claims19
A method of operation for an integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA) performed in accordance with any of the embodiments described or shown herein.
A system for an integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA) configured in accordance with any of the embodiments described or shown herein.
A two-sided ID die configured in accordance with any of the embodiments described or shown herein.
Dependencies are inferred from the claim text.