Method of Manufacturing a Package Having a Power Semiconductor Chip
AssigneeInfineon Technologies Austria AG
InventorsThomas Basler, Edward Fuergut, Christian Kasztelan, Ralf Otremba
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Abstract
A method of manufacturing a semiconductor power package includes: embedding a power semiconductor chip in an encapsulation, the encapsulation forming a housing of the semiconductor power package; and extending a layer of a covering material over at least a part of an outer main surface of the encapsulation. The covering material has a thermal conductivity greater than a thermal conductivity of the material of the encapsulation and/or a temperature stability greater than a temperature stability of the pre-molded chip housing.
Claims20
A method of manufacturing a semiconductor power package, the method comprising:
- embedding a power semiconductor chip in an encapsulation, the encapsulation forming a housing of the semiconductor power package;
- and
- extending a layer of a covering material over at least a part of an outer main surface of the encapsulation, the covering material having a thermal conductivity greater than a thermal conductivity of the material of the encapsulation.
A method of manufacturing a semiconductor power package, the method comprising:
- embedding a power semiconductor chip in an encapsulation, the encapsulation forming a housing of the semiconductor power package;
- and
- extending a layer of a covering material over at least a part of an outer main surface of the encapsulation, the covering material having a temperature stability greater than a temperature stability of the pre-molded chip housing.
Dependencies are inferred from the claim text.