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US 2019/0198354 A1Published application
Methods of fabricating semiconductor packages
AssigneeFoundation for Research and Business, Seoul National University of Science and Technolgy
InventorsSung Dong KIM, Ju Hwan JUNG
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Abstract
A method of fabricating semiconductor packages includes forming an insulating polymer layer on a substrate to cover a plurality of conductive patterns on the substrate, planarizing the insulating polymer layer by pressing the insulating polymer layer downward by using at least one pressure member, and patterning the planarized insulating polymer layer to expose at least parts of the plurality of conductive patterns.
Claims14
A method of fabricating semiconductor packages, the method comprising:
- forming an insulating polymer layer on a substrate to cover a plurality of conductive patterns on the substrate;
- planarizing the insulating polymer layer by pressing the insulating polymer layer downward by using at least one pressure member;
- and
- patterning the planarized insulating polymer layer to expose at least parts of the plurality of conductive patterns.
1 more element
Dependencies are inferred from the claim text.