Switch-mode converter module
AssigneeTexas Instruments Incorporated
InventorsKristen Nguyen PARRISH, Charles DEVRIES
Life of this patent
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Abstract
A method for manufacturing a switch-mode converter includes forming a plurality of windings by coiling one or more conductors. Each of the windings is secured to one of a plurality of module bases arranged in a module array. At least one side of the array is encapsulated in a magnetic mold compound.
Claims22
1-10. (canceled)
A method for manufacturing a switch-mode converter, comprising:
- attaching a power supply switching component to a module substrate;
- coiling a conductor to form a winding;
- securing the winding to the module substrate;
- inserting a core of magnetic material into the winding;
- and
- covering the power supply switching component, the winding, and the core in a magnetic mold compound.
The method of 11, wherein the conductor is round or rectangular.
The method of 11, wherein the covering comprises encasing all components attached to one side of the module substrate in the magnetic mold compound.
A switch-mode power supply module, comprising:
- a substrate;
- a winding attached to the substrate;
- a power supply switching component attached to the substrate, wherein the power supply switching component is configured to drive the winding;
- a magnetic core disposed in the winding;
- and
- magnetic mold compound encasing the winding, the magnetic core, and the power supply switching component.
The switch-mode power supply module of claim 1, further comprising a winding lead frame;
- wherein the winding is attached to the winding lead frame, and the winding lead frame is affixed to the substrate.
The switch-mode power supply module of claim 1, wherein a diameter of a first end of the magnetic core is greater than a diameter of a second end of the magnetic core.
A semiconductor package, comprising:
- a first substrate;
- a winding attached to the first substrate via a second substrate;
- a magnetic core disposed in the winding;
- a power supply switching component directly attached to the first substrate;
- and
- mold compound covering portions of the winding and the magnetic core.
(canceled)
Dependencies are inferred from the claim text.