Package structure and method thereof
AssigneeSilergy Semiconductor Technology (Hangzhou) LTD
InventorXiaochun Tan
Life of this patent
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Abstract
A package structure can include: (i) a substrate having opposite first and second surfaces; (ii) a die having opposite active and back surfaces, where the die is arranged above the first surface of the substrate, the back surface of the die is adjacent to the first surface of the substrate; (iii) pads arranged on the active surface of the die; (iv) a first encapsulator configured to encapsulate the die; (v) an interconnection structure configured to electrically connect to the pads through the first encapsulator; (vi) a second encapsulator configured to encapsulate the interconnection structure; and (vii) a redistribution structure configured to electrically connect to the interconnection structure and to provide external electrical connectivity.
Claims25
A package structure, comprising:
- a) a substrate having opposite first and second surfaces;
- b) a die having opposite active and back surfaces, wherein said die is arranged above said first surface of said substrate, said back surface of said die is adjacent to said first surface of said substrate;
- c) pads arranged on said active surface of said die;
- d) a first encapsulator configured to encapsulate said die;
- e) an interconnection structure configured to electrically connect to said pads through said first encapsulator;
- f) a second encapsulator configured to encapsulate said interconnection structure;
- g) a redistribution structure comprising a first metal layer, and a solder layer on said first metal layer and conformal to said first metal layer, wherein said redistribution structure is configured to electrically connect to said interconnection structure and to provide external electrical connectivity through said solder layer;
- h) wherein said interconnection structure comprises a plurality of interconnection components having a second metal layer and a third metal layer, wherein said third metal layer is located on said second metal layer;
- i) wherein each of said interconnection components comprises a first portion extending along a surface of said first encapsulator, and a second portion extending to said pads in said first encapsulator;
- and
- j) wherein a first surface of said first portion of said each of said interconnection components is flat.
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A method of making a package structure, the method comprising:
- a) providing a substrate;
- b) arranging a die on a first surface of said substrate, wherein said die comprises opposite active and back surfaces, said back surface being adjacent to said first surface;
- c) arranging pads on said active surface;
- d) forming a first encapsulator to encapsulate said die;
- e) forming an interconnection structure that is electrically connected to said pads through said first encapsulator;
- f) forming a second encapsulator to encapsulate said interconnection structure;
- g) forming a redistribution structure comprising a first metal layer, and a solder layer on said first metal layer and conformal to said first metal layer, wherein said redistribution structure is electrically connected to said interconnection structure to provide external electrical connectivity through said solder layer;
- h) wherein said interconnection structure comprises a plurality of interconnection components having a second metal layer and a third metal layer, wherein said third metal layer is located on said second metal layer;
- i) wherein each of said interconnection components comprises a first portion extending along a surface of said first encapsulator, and a second portion extending to said pads in said first encapsulator;
- and
- j) wherein a first surface of said first portion of said each of said interconnection components is flat.
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Dependencies are inferred from the claim text.