Laser irradiation apparatus and method for manufacturing semiconductor device
AssigneeThe Japan Steel Works, Ltd.
InventorsDaisuke ITO, Tamotsu ODAJIMA, Ryo SHIMIZU, Masashi MACHIDA, Tatsuro MATSUSHIMA
Life of this patent
Estimating the term…
Abstract
A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).
Claims19
A laser irradiation apparatus comprising:
- an optical-system module configured to apply laser light to an object to be irradiated;
- a first shield plate in which a first slit is formed, through which the laser light passes;
- and
- a reflected-light receiving component disposed between the optical-system module and the first shield plate, wherein
- the reflected-light receiving component is able to receive, out of the laser light, first reflected light reflected by the first shield plate.
A method for manufacturing a semiconductor device comprising the steps of:
- (A) emitting laser light from an optical-system module toward a substrate on which a film including a semiconductor is formed;
- (B) providing a first shield plate in which a first slit is formed, through which the laser light passes, and making, out of the laser light applied to the first slit and the first shield plate, part of the laser light applied to the first slit pass through the first slit;
- (C) blocking, out of the laser light applied to the first slit and the first shield plate, part of the laser light applied to the first shield plate by the first shield plate;
- (D) disposing a reflected-light receiving component between the optical-system module and the first shield plate, and making the reflected-light receiving component receive a first reflected light, the first reflected light being light that is generated as the laser light is applied to the first shield plate and reflected by the first shield plate;
- and
- (E) irradiating the substrate with, out of the laser light applied to the first slit and the first shield plate, the laser light that has passed through the first slit.
Dependencies are inferred from the claim text.