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AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsIsao HIRANO, Takehiro SESHIMO, Yu TSEWEI, Chuang YACHIEN
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To provide a method for removing an organic cured film on a substrate, which can satisfactorily remove the organic cured film formed on the substrate while suppressing damage on a wiring material such as copper, and an acidic cleaning liquid which can be preferably used in the method. When removing an organic cured film on a substrate, the organic cured film is contacted with an acidic cleaning liquid, and an acidic cleaning liquid, which includes sulfuric acid and a water-soluble organic solvent and does not include a compound capable of generating nitronium ions, the content of water being 5% by mass or less, is used as the acidic cleaning liquid.
A method comprising contacting an organic cured film on a substrate with an acidic cleaning liquid to thereby remove the organic cured film from the substrate, wherein the acidic cleaning liquid comprises sulfuric acid and a water-soluble organic solvent and does not comprise a compound capable of generating nitronium ions, and
An acidic cleaning liquid for removal of an organic cured film, which comprises sulfuric acid and a water-soluble organic solvent and does not comprise a compound capable of generating nitronium ions, wherein the content of water is 5% by mass or less.
Dependencies are inferred from the claim text.