Cooling mechanism utlized in a plasma reactor with enhanced temperature regulation
AssigneeApplied Materials, Inc.
InventorsAniruddha PAL, Victor CALDERON, Martin Jeffrey SALINAS, Valentin N. TODOROW
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Abstract
Embodiments of the invention generally provide a cooling mechanism utilized in a plasma reactor that may provide efficient temperature control during a plasma process. In one embodiment, a cooling mechanism disposed in a plasma processing apparatus includes a coil antenna enclosure formed in a processing chamber, a coil antenna assembly disposed in the coil antenna enclosure, a plurality of air circulating elements disposed in the coil antenna enclosure adjacent to the coil antenna assembly, and a baffle plate disposed in the coil antenna enclosure below and adjacent to the coil antenna assembly.
Claims1
A method for regulating temperature of a coil antenna assembly disposed in a processing chamber comprising:
- rotating a plurality of air circulating means disposed adjacent to a coil antenna assembly in a coil antenna enclosure;
- directing air in ambient supplied from a perforation formed on a sidewall of the coil antenna enclosure;
- guiding the air by a baffle plate to a center region of the coil antenna assembly through a central opening formed in the baffle plate;
- and
- circulating the air out of the coil antenna enclosure
Dependencies are inferred from the claim text.