Multi-layer ceramic electronic component, multi-layer ceramic electronic component mounting substrate, and multi-layer ceramic electronic component package

A multi-layer ceramic electronic component mounting substrate, comprising:

• a circuit board;
• and
• a multi-layer ceramic electronic component including
• a ceramic body including internal electrodes laminated in a first direction, and
• a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, the multi-layer ceramic electronic component being mounted onto the circuit board via the pair of external electrodes,
• a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first direction and the second direction,
• the ceramic body including a pair of main surfaces including a center region facing in the first direction, the center region being formed at a center portion of at least one of the pair of main surfaces in the second direction,
• the multi-layer ceramic electronic component being mounted onto the circuit board with the center region being faced outward in the first direction.

A multi-layer ceramic electronic component package, comprising:

• a multi-layer ceramic electronic component including
• a ceramic body including internal electrodes laminated in a first direction, and
• a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, the multi-layer ceramic electronic component being mounted onto a circuit board via the pair of external electrodes;
• a housing portion including a recess that houses the multi-layer ceramic electronic component and includes a take-out opening;
• and
• a sealing portion that covers the take-out opening of the recess,
• a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first direction and the second direction,
• the ceramic body including a pair of main surfaces including a center region facing in the first direction, the center region being formed at a center portion of at least one of the pair of main surfaces in the second direction,
• the multi-layer ceramic electronic component being housed in the recess with the center region being faced to the take-out opening.