Electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsKunihiro MIYAHARA, Yutaka MASUDA, Kanta MOTOKI, Shoji NAGUMO
Life of this patent
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Abstract
An electronic component includes a multilayer body including dielectric layers, a circuit pattern, and band-shaped conductor patterns. The circuit pattern includes a conductor pattern that is disposed inside the multilayer body and defines an inductor. The band-shaped conductor patterns are grounded and cover a portion of a shield surface. An internal surface is located between the circuit pattern and an upper surface. On a shield surface, a non-shielded area is provided which is not covered with any of the band-shaped conductor patterns, and through which magnetic flux generated from the inductor is able to pass.
Claims14
An electronic component comprising:
- a multilayer body including a plurality of dielectric layers;
- a circuit pattern disposed inside the multilayer body and including a conductor pattern defining an inductor;
- and
- a plurality of band-shaped conductor patterns that are grounded;
- wherein
- the multilayer body includes an upper surface, a lower surface opposing the upper surface, a side surface connecting the upper surface and the lower surface, and an internal surface located between the circuit pattern and the upper surface and parallel or substantially parallel to the upper surface;
- the plurality of band-shaped conductor patterns cover a portion of a shield surface including at least one of the upper surface, the side surface, and the internal surface;
- and
- a non-shielded area is provided on the shield surface which is not covered with any of the plurality of band-shaped conductor patterns, and through which magnetic flux generated from the inductor is able to pass.
An electronic component comprising:
- a multilayer body including a plurality of dielectric layers;
- a circuit pattern disposed inside the multilayer body and including a conductor pattern defining an inductor that is wound around a winding axis;
- and
- a partial shield portion that is grounded;
- wherein
- the electronic component further including an upper surface, a lower surface opposing the upper surface, a side surface connecting the upper surface and the lower surface, and an internal surface located between the circuit pattern and the upper surface and parallel or substantially parallel to the upper surface;
- the partial shield portion covers a portion of a shield surface including at least one of the upper surface, the side surface, and the internal surface;
- a non-shielded area that is not covered with the partial shield portion is provided on the shield surface;
- and
- the non-shielded area overlaps with a portion of an air-core section of the inductor in a plan view from a direction of the winding axis.
Dependencies are inferred from the claim text.