Electronic substrates having embedded magnetic material using photo-imagable dielectric layers
AssigneeIntel Corporation
InventorsSai Vadlamani, Prithwish Chatterjee, Lauren A. Link, Andrew J. Brown
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Abstract
An electronic structure may be fabricated comprising an electronic substrate having at least one photo-imageable dielectric layer and an inductor embedded in the electronic substrate, wherein the inductor comprises a magnetic material layer disposed within a via formed in the at least one photo-imageable dielectric layer and an electrically conductive via extending through the magnetic material layer. The electronic structure may further include an integrated circuit device attached to the electronic substrate and the electronic substrate may further be attached to a board, such as a motherboard.
Claims20
An inductor, comprising:
- a photo-imageable dielectric layer having a via formed therethrough;
- a magnetic material layer disposed within the via of the photo-imageable dielectric layer;
- and
- an electrically conductive via extending through the magnetic material layer.
An electronic structure, comprising:
- an electronic substrate having at least one photo-imageable dielectric layer;
- and
- an inductor embedded in the electronic substrate, wherein the inductor comprises a magnetic material layer disposed within a via formed through the at least one photo-imageable dielectric layer and an electrically conductive via extending through the magnetic material layer.
An electronic system, comprising:
- a board;
- and
- an electronic package attached to the board, wherein the electronic package comprises:
- an electronic substrate having at least one photo-imageable dielectric layer;
- an inductor embedded in the electronic substrate, wherein the inductor comprises a magnetic material layer disposed within a via formed in the at least one photo-imageable dielectric layer and an electrically conductive via extending through the magnetic material layer;
- and
- an integrated circuit device electrically attached to the electronic substrate.
A method of fabricating an electronic structure, comprising:
- forming an electronic substrate having at least one photo-imageable dielectric layer;
- forming at least one via through the at least one photo-imageable dielectric layer;
- forming a magnetic material layer within the at least one via;
- and
- forming an electrically conductive via extending through the magnetic material layer.
Dependencies are inferred from the claim text.