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US 2019/0198221 A1Published application
Chip electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorKwang Sun Choi
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Abstract
A chip electronic component includes a magnetic body including first magnetic metal particles, internal coil portions embedded within the magnetic body, and insulation resistance layers disposed on upper and lower surfaces of the magnetic body and including second magnetic metal particles having an oxide coating.
Claims19
A chip electronic component comprising:
- a magnetic body including first magnetic metal particles;
- internal coil parts embedded within the magnetic body;
- and
- insulation resistance layers disposed on opposing upper and lower surfaces of the magnetic body, and including second magnetic metal particles having an oxide coating.
1 more element
A chip electronic component comprising:
- a magnetic body including first magnetic metal particles;
- internal coil parts embedded within the magnetic body;
- and
- insulation resistance layers disposed on upper and lower surfaces of the magnetic body,
- wherein the insulation resistance layers include second magnetic metal particles, each of second magnetic metal particles having a core and an oxide coating covering the core;
- and
- a D50 of the first magnetic metal particles and a D50 of the second magnetic metal particles are the same.
4 more elements
An electronic component comprising:
- an internal coil having a plurality of coil windings surrounding a central hole;
- and
- a magnetic core portion embedding the internal coil and extending through the central hole,
- wherein a surface of the magnetic core portion has an insulation resistance layer disposed thereon, and the insulation resistance layer includes magnetic particles coated with an oxide.
1 more element
Dependencies are inferred from the claim text.