Inductor and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorSang Jae LEE
Life of this patent
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Abstract
There are provided an inductor and a method of manufacturing the same. The inductor includes: a support member; a first coil pattern formed on one surface of the support member; and a second coil pattern formed on the other surface of the support member, wherein a thickness of the support member between the first coil pattern and the second coil pattern is 1/10 or more of a thickness of the first coil pattern and is less than ⅓ of the thickness of the first coil pattern.
Claims20
An inductor comprising:
- a support member;
- a first coil pattern formed on one surface of the support member;
- and
- a second coil pattern formed on the other surface of the support member,
- wherein a thickness of the support member between the first coil pattern and the second coil pattern is 1/10 or more of a thickness of the first coil pattern and is less than ⅓ of the thickness of the first coil pattern.
A method of manufacturing an inductor, comprising:
- forming a support member by disposing an insulating film on one surface of a delamination substrate;
- forming a first coil pattern on one surface of the support member;
- forming a complementary layer on the one surface of the support member;
- removing the delamination substrate;
- and
- forming a second coil pattern on the other surface of the support member.
A method of manufacturing an inductor, the method comprising:
- forming a first coil pattern on a first surface of a first insulating layer of a delamination substrate, the delamination substrate comprising a plurality of layers including the first insulating layer;
- forming a second insulating layer on the first surface of the delamination substrate;
- removing portions of the delamination substrate except the first insulating layer to expose a second surface of the insulating layer;
- and
- forming a second coil pattern on the exposed second surface of the insulating layer.
Dependencies are inferred from the claim text.