US 2019/0198203 A1 · SURFACE-MOUNTABLE THIN FILM RESISTOR NETWORK

Abstract

Provided is a surface-mountable thin film resistor network, which includes a chip, on which a thin film resistor network integrated array is formed, and a molded resin package, which encapsulate the chip. The surface-mountable thin film resistor network is provided with a chip (13) on which a thin film resistor integrated array has been formed; an island (12) on which the chip is fixed; a plurality of lead terminals (14) extending outward around periphery of the island; wires (15) connecting electrodes of resistors mounted on the chip to the lead terminals; and a molded resin package (20) that encapsulate a portion, which includes the wires; wherein a hanging lead (18) extending from the island is cut at an end surface of the molded resin package, and an electrical insulation (21) is applied to the cut section of the hanging lead.

Claims4

Dependent claims

A surface-mountable thin film resistor network comprising:

a chip on which a thin film resistor integrated array has been formed;
an island on which the chip is fixed;
a plurality of lead terminals extending outward around periphery of the island;
wires connecting electrodes of resistors mounted on the chip to the lead terminals;
and
a molded resin package that encapsulate a portion, which includes the wires;
wherein a hanging lead extending from the island is cut at an end surface of the molded resin package, and an electrical insulation is applied to the cut section of the hanging lead.

4 more elements

Dependencies are inferred from the claim text.

Surface-mountable thin film resistor network

Life of this patent

Surface-mountable thin film resistor network

Life of this patent

Abstract

Claims4