Information handling system housing heat spreader
AssigneeDell Products L.P.
InventorsAndrew T. Sultenfuss, Travis C. North, Deeder M. Aurongzeb
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Abstract
Thermal energy exposed at the outer surface of an information handling system housing is managed by spreading the thermal energy across the housing X and Y axes while restricting heat transfer from the housing at the Z axis. For example, a graphene outer surface couples to an aerogel substrate strengthened by a carbon fiber laminate. The graphene spreads thermal energy that escapes through the housing across the housing outer surface to limit the impact of thermal energy at any particular location, such as proximate to the location of a processor.
Claims13
1-8. (canceled)
A method for manufacture of an electronic device housing, the method comprising:
- forming a substrate into at least a portion of the electronic device housing;
- and
- coupling graphene to at least a portion of the outer surface of the substrate.
A method for forming an electronic device housing, the method comprising:
- laminating carbon fiber to form a first layer of the electronic device housing;
- coupling an aerogel to the carbon fiber to form a second layer of the electronic device housing;
- and
- coupling graphene to the aerogel to form an outer surface of the electronic device housing.
Dependencies are inferred from the claim text.