Touch sensor, touch panel and method for manufacturing the same
AssigneeTPK Touch Solutions (Xiamen) Inc.
InventorsChing-Shan Lin, Chun-Yan Wu, Chung-Chin Hsiao, Hwai-Hai Chiang
Life of this patent
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Abstract
A manufacturing method of touch sensors is provided. A flexible touch sensing component can be formed on a first substrate by a release layer. Next, the flexible touch sensing component is transferred to a second substrate after a releasing step. Furthermore, by the support of the second substrate, the flexible touch sensing component can be processed and then adhered a desired cover. After releasing the second substrate from the flexible touch sensing component, the touch sensor is formed.
Claims31
A manufacturing method of a touch panel, comprising:
- S1:
- forming a first release layer on a first substrate;
- S2:
- forming a flexible touch sensing component on the first release layer;
- S3:
- forming a second substrate on the flexible touch sensing component, and a second release layer is interposed between the flexible touch sensing component and the second substrate;
- S4:
- removing the first substrate by releasing the first release layer;
- S5:
- attaching a decorative flexible cover onto the flexible touch sensing component by using a bonding layer, and wherein the bonding layer is interposed between the decorative flexible cover and the flexible touch sensing component;
- and
- S6:
- removing the second substrate by releasing the second release layer.
A manufacturing method of a touch panel, comprising the steps of:
- S1:
- forming a first release layer on a first substrate;
- S2:
- forming a shielding layer and a flexible touch sensing component on the first release layer, wherein the shielding layer define a peripheral area;
- S3:
- forming a second substrate on the flexible touch sensing component, and a second release layer is interposed between the flexible touch sensing component and the second substrate;
- S4:
- removing the first substrate by releasing the first release layer;
- S5:
- attaching a flexible cover to the flexible touch sensing component by using a bonding layer, and the bonding layer is interposed between the flexible cover and the flexible touch sensing component;
- and
- S6:
- removing the second substrate by releasing the second release layer.
Dependencies are inferred from the claim text.