Method of producing metal mesh type transparent conducting film using photoresist engraved pattern and surface modification and transparent conducting film produced by the same

Abstract

Provided is a method of producing a metal mesh type transparent conducting film using a photoresist engraved pattern and surface modification including (S1) forming a photoresist layer 20 on an upper surface of a substrate 10 or an upper surface and lower surface of a substrate 10; (S2) forming an engraved pattern portion in which embossed portions 21 and engraved portions 22 are arranged in a mesh shape in the photoresist layer 20; (S3) depositing a first metal film conductive layer 40 on the engraved pattern portion of the photoresist layer 20, or growing a second metal film conductive layer 50 through a plating process on the first metal film conductive layer 40 in which deposition is completed; (S4) surface-modifying with dry ice powders a surface of the substrate in which deposition or plating is completed; and (S5) removing the embossed portions 21 of the photoresist layer 20, and by forming a thick metal film conductive layer and then performing a wet etching process, by enabling not to perform a wet etching process after forming the thick metal film conductive layer, and by facilitating desorption through surface modification using dry ice, process complexity can be improved and a defect rate can be reduced. Further, it is possible to provide a transparent conducting film having high reliability by greatly reducing visibility through upper and lower low-reflective layers deposited in the engraved portion and enabling to serve as an adhesive layer in the lower portion and as a protective layer in the upper layer.

Dependencies are inferred from the claim text.