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US 2019/0196331 A1Published application
Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsHitoshi Maruyama, Kazunori Kondo
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Abstract
A photosensitive resin composition comprising a dual end alicyclic epoxy-modified silicone resin having formula (A1) and a photoacid generator is provided. In formula (A1), R1 to R4 are a C1-C20 monovalent hydrocarbon group and n is an integer of 1-600. The composition enables pattern formation using radiation of widely varying wavelength, and the patterned film has high transparency, light resistance, and heat resistance.
Claims8
A photosensitive resin composition comprising
- (A) a dual end alicyclic epoxy-modified silicone resin having the formula (A1):
- wherein R1 to R4 are each independently a C1-C20 monovalent hydrocarbon group which may contain a heteroatom, n is an integer of 1 to 600, with the proviso that when n is an integer of at least 2, groups R3 may be identical or different and groups R4 may be identical or different, and
- (B) a photoacid generator.
Dependencies are inferred from the claim text.