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US 2019/0195937 A1Published application
Semiconductor chip with fracture detection
AssigneeInfineon Technologies AG
InventorsThomas Zettler, Dirk Hammerschmidt, Friedrich Rasbornig, Wolfgang Scheibenzuber, Hans-Joerg Wagner
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Abstract
A method including feeding a test signal into a first end of a conductor track of a semiconductor chip, wherein the conductor track crosses an indentation of a substrate of the semiconductor chip; and detecting the test signal at a second endsof the conductor track, which wherein the detected test signal is indicative of fracture of the substrate of the semiconductor chip at the indentation.
Claims20
A method, comprising:
- feeding a test signal into a first end of a conductor track of a semiconductor chip, wherein the conductor track crosses an indentation of a substrate of the semiconductor chip;
- and
- detecting the test signal at a second end of the conductor track, wherein the detected test signal is indicative of fracture of the substrate of the semiconductor chip at the indentation.
A method, comprising:
- detecting a test signal at an end of a conductor track of a semiconductor chip, wherein the detected test signal is indicative of fracture of a substrate of the semiconductor chip at an indentation of the substrate;
- and
- depending on the detection, providing an output signal from at least one of a first component and a second component of an integrated circuit arranged on the substrate,
- wherein the first component and the second component are configured to output redundant output signals.
1 more element
Dependencies are inferred from the claim text.