Low force wafer test probe with variable geometry
AssigneeInternational Business Machines Corporation
InventorsDavid M. Audette, Dennis R. Conti, Marc D. Knox, Grant W. Wagner
Life of this patent
Estimating the term…
Abstract
A system for testing functionality of die on a wafer including a plurality of contacts includes a support structure and a plurality of probes mounted to the support structure in an array. A configuration of each of the plurality of probes varies based on a position of the probe within the array to maintain uniform engagement between the plurality of probes and a corresponding plurality of contacts across the array.
Claims21
A system for testing functionality of die on a wafer including a plurality of contacts, comprising:
- a support structure;
- a plurality of probes mounted to the support structure in an array, wherein a configuration of each of the plurality of probes varies based on a position of each of the plurality probes within the array to maintain uniform engagement between the plurality of probes and a corresponding plurality of contacts across the array.
A system for testing functionality of die on a wafer including a plurality of contacts, comprising:
- a support structure;
- a plurality of probes mounted to the support structure in an array, wherein a configuration of each of the plurality of probes is selected based on an expected deflection of the support structure at a position associated with each of the plurality of probes.
A method of forming a probe array comprising:
- determining an expected deflection of a support structure of the probe array;
- and
- connecting a plurality of probes to the support structure, wherein a configuration of each of the plurality of probes is dependent on the expected deflection of the support structure at a position of the probe.
Dependencies are inferred from the claim text.