Ambient light sensor with light protection

A method, comprising:

• positioning a plurality of ambient light sensor assemblies in a mold cavity, each of the ambient light sensor assemblies including an ambient light sensor die having a light sensor at a first surface of the ambient light sensor die, and conductive bumps on a second surface of the ambient light sensor die, the second surface being opposite to the first surface;
• covering exposed portions of the ambient light sensor assemblies in the mold cavity with a light shielding layer;
• removing the ambient light sensor assemblies from the mold cavity;
• and
• forming separate ambient light sensor packages by sawing through portions of the light shielding layer between adjacent ambient light sensor assemblies.

A method, comprising:

• forming trenches in an ambient light sensor wafer, the trenches positioned between neighboring light sensors that form respective first portions of a first surface of the ambient light sensor wafer;
• forming a light shielding layer in the trenches and on second portions of the first surface of the ambient light sensor wafer;
• forming conductive bumps on a second surface of the ambient light sensor wafer, the second surface being opposite to the first surface;
• and
• sawing through portions of the light shielding layer in the trenches.