Chip-on-board modular lighting system and method of manufacture
AssigneeLumileds LLC
InventorRonald BONNE
Life of this patent
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Abstract
Chip-on-board (COB) modular lighting systems and methods of manufacture are described herein. A system includes a COB assembly including a thermally conductive plate and a COB light-emitting diode (LED) device thermally coupled to the thermally conductive plate. The COB LED device includes multiple LED chips disposed on a surface of a substrate. The substrate includes first electrical power contacts exposed from at least the surface. The system further includes an electronics board that has second electrical power contacts. The electronics board is attached to the COB assembly such that the first and second electrical contacts are electrically coupled and the thermally conductive plate is attached to the electronics board.
Claims20
A system comprising:
- a chip-on-board (COB) assembly including:
- a thermally conductive plate, and
- a COB light-emitting diode (LED) device including a plurality of LED chips disposed on a surface of a substrate, the substrate including first electrical power contacts exposed from at least the surface,
- the COB LED device being thermally coupled to the thermally conductive plate;
- and
- an electronics board having second electrical power contacts, the electronics board attached to the COB assembly such that the first and second electrical power contacts are electrically coupled and the thermally conductive plate is attached to the electronics board.
A system comprising:
- a plurality of chip-on-board (COB) light-emitting diode (LED) device sub-systems, each of the plurality of COB LED device sub-systems comprising:
- a COB assembly including a thermally conductive plate and a COB LED device thermally coupled to the thermally conductive plate, the COB LED device including a plurality of LED chips disposed on a surface of a substrate, the substrate including first electrical power contacts exposed from at least the surface,
- an electronics board having second electrical power contacts, the electronics board attached to the COB assembly such that the first and second electrical power contacts are electrically coupled and the thermally conductive plate is attached to the electronics board, and
- an interface configured to receive a direct current (DC) voltage from a single external power supply.
A method of assembling a chip-on-board (COB) light-emitting diode (LED) device system, the method comprising:
- providing a COB LED device that includes a plurality of LED chips disposed on a surface of a substrate, the substrate including first electrical power contacts exposed from at least the surface;
- thermally coupling the COB LED device to a thermally conductive plate to form a COB assembly;
- providing an electronics board having second electrical power contacts;
- positioning the electronics board relative to the COB assembly such that the first and second electrical power contacts are aligned;
- soldering together the first and second electrical power contacts;
- and
- attaching the thermally conductive plate to the electronics board.
Dependencies are inferred from the claim text.