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US 2019/0194821 A1Published application
Method of treating a single crystal silicon ingot to improve the lls ring/core pattern
AssigneeGlobalWafers Co., Ltd.
InventorsWonJin Choi, JunHwan Ji, UiSung Jung, JungHan Kim, YoungJung Lee, ChanRae Cho
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Abstract
A method is disclosed for reducing the size and density of defects in a single crystal silicon wafer. The method involves subjected a single crystal silicon ingot to an anneal prior to wafer slicing.
Claims35
A method of processing a single crystal silicon ingot, the method comprising:
- grinding the single crystal silicon ingot, wherein the single crystal silicon ingot comprises a seed end, a tail end opposite the seed end, and a main body between the seed end and the tail end, wherein the main body is ground to a constant diameter;
- annealing the ground single crystal silicon ingot for a temperature and duration sufficient to reduce the size or number of localized laser scattering defects on a wafer sliced from the single crystal silicon ingot;
- and
- slicing the annealed single crystal silicon ingot into at least two single crystal silicon wafers.
1 more element
A method of processing a single crystal silicon ingot, the method comprising:
- removing a seed cone and a tail cone from the single crystal silicon ingot, wherein the single crystal silicon ingot comprises the seed cone, the tail cone opposite the seed cone, and a main body between the seed cone and the tail cone;
- cropping the main body of the single crystal silicon ingot so that the main body of the single crystal silicon ingot comprises one or more single crystal silicon segments, wherein the thickness of a segment is at least about 1 cm, at least about 10 cm, or at least about 20 cm;
- annealing one or more of the cropped single crystal silicon segments for a temperature and duration sufficient to reduce the size or number of localized laser scattering defects on a wafer sliced from the single crystal silicon segment;
- and
- slicing the annealed single crystal silicon segment into at least two single crystal silicon wafers.
2 more elements
Dependencies are inferred from the claim text.