Low temperature adhesive bond material

A method for handling a device wafer, comprising:

• coating a carrying surface of one of the device wafer or a handle with a low temperature adhesive bond material that comprises:
• a suspended polymer that has a glass transition temperature (Tg) greater than room temperature;
• and
• a diluent polymer that is liquid at room temperature and is curable to provide a thermoset polymer upon exposure to ultraviolet radiation, x-ray radiation and/or thermal treatments at low temperature;
• wherein the suspended polymer and the diluent polymer are mixed to a consistency such that before curing of the diluent polymer the low temperature adhesive bond material exhibits adhesion strength less than 10 Newtons per square centimeter (N/cm2), wherein after curing of the diluent polymer the low temperature adhesive bond material exhibits adhesion strength not less than about 40 N/cm2;
• and
• while holding the coated carrying surface against the carrying surface of the other of the device wafer or the handle, bonding the device wafer to the handle by irradiating the coated carrying surface with radiation at a first wavelength at low temperature to cure the diluent polymer.

An apparatus comprising:

• a device wafer;
• a handle;
• and
• a low temperature adhesive bond material bonding a carrying surface of the device wafer to a carrying surface of the handle, wherein the low temperature adhesive bond material comprises:
• a suspended polymer with glass transition temperature greater than room temperature;
• and
• a diluent polymer that is curable to provide a thermoset polymer upon exposure to ultraviolet radiation, x-ray radiation and/or thermal treatments at low temperature;
• wherein the suspended polymer and the diluent polymer are mixed to a consistency such that before curing of the diluent polymer the low temperature adhesive bond material exhibits adhesion strength less than 10 Newtons per square centimeter (N/cm2), wherein after curing of the diluent polymer the low temperature adhesive bond material exhibits adhesion strength not less than about 40 N/cm2.