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US 2019/0194496 A1Published application
Polyimide film for semiconductor package reflow process, and manufacturing method therefor
AssigneeIpi Tech Inc.
InventorsKye-Ung LEE, Ho-Young PARK, Tae-Seok LEE
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Abstract
Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.
Claims10
A polyimide film for a semiconductor package reflow process, comprising:
- a non-thermoplastic polyimide layer;
- a thermoplastic polyimide layer piled onto the non-thermoplastic polyimide layer and having glass transition temperature lower than or equal to reflow temperature;
- and
- an adhesive layer attached onto the thermoplastic polyimide layer,
- wherein a surface of the thermoplastic polyimide layer is modified with a carboxyl group.
2 more elements
A manufacturing method for a polyimide film for a semiconductor package reflow process, comprising:
- step (a) of preparing a non-thermoplastic polyimide layer
- step (b) of attaching, onto the non-thermoplastic polyimide layer, a thermoplastic polyimide layer which has glass transition temperature lower than or equal to reflow temperature and whose surface is modified with a carboxyl group;
- and
- step (c) of attaching an adhesive layer onto the thermoplastic polyimide layer.
1 more element
Dependencies are inferred from the claim text.