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US 2019/0194408 A1Published application
Thermally conductive resin, resin composition, prepreg, and copper clad laminate
AssigneesIndustrial Technology Research Institute, Iteq Corporation
InventorsFeng-Po TSENG, Wen-Pin TING, Kuo-Chan CHIOU
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Abstract
A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is in which R1 is —CH2—, —C(═O)—, or —(CH2)—(C6H5)—, and R2 is H or CH3.
Claims9
A thermally conductive resin, having a chemical structure of:
- wherein R1 is —CH2—, —C(═O)—, or —(CH2)—(C6H5)—, and R2 is H or CH3.
A resin composition, comprising:
- 1 part by weight of a thermally conductive resin;
- 0.001 to 0.05 parts by weight of radical initiator;
- and
- 0.05 to 0.30 parts by weight of crosslinking agent,
- wherein the thermally conductive resin has a chemical structure of:
- wherein R1 is —CH2—, —C(═O)—, or —(CH2)—(C6H5)—, and
- R2 is H or CH3.
4 more elements
Dependencies are inferred from the claim text.