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AssigneeThe Government of the United States of America, as represented by the Secretary of the Navy
InventorsRaymond C.Y. Auyeung, Joseph C. Prestigiacomo, Michael S. Osofsky
Estimating the term…
A method of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising cutting and placing a length of a solder ribbon onto a semiconductor release tape forming a solder ribbon and semiconductor release tape combination, placing the solder ribbon and semiconductor release tape combination on a vacuum chuck on X-Y stage pair in a laser micromachining system, adjusting the working distance, laser-cutting an outline, peeling off the solder ribbon, allowing the desired solder shape to remain, creating indexing holes, providing a target surface on an alignment fixture with indexing pins, aligning the indexing holes, placing the semiconductor release tape with the desired solder shape on the target surface, pressing the desired solder shape onto the target surface, removing the release tape, and making a pattern of the desired solder shape with precise alignment and decal bonding on the target surface.
A method of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising:
The product of the process of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising the steps of:
Dependencies are inferred from the claim text.