# US 2019/0174659 A1 · Ciruit board assembly and shielding device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0174659 A1 - Document ID: US20190174659A1 - Status: Published application - Kind: A1 - Application number: 16/192,541 - Filed: 2018-11-15 - Published: 2019-06-06 - Earliest claimed: 2017-12-04 - Assignees: Pegatron Corporation - Applicants: Pegatron Corporation - Inventors: Wen-Chi Lin; Wei-Chun Tsao; Yao-Chiang Yang - Web page: https://patentgrep.com/patent/US20190174659A1 ## CPC - H05K 9/0081: {Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence)} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing} - H05K 9/0032: {having multiple parts, e.g. frames mating with lids} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A circuit board assembly includes a circuit board, a shielding frame, a chip, and a heat dissipating member. The shielding frame is fixed to and protrudes from the circuit board. The shielding frame includes a first encircled positioning portion away from the circuit board. The chip is disposed on the circuit board and is located in the shielding frame. The heat dissipating member is detachably disposed on the shielding frame, and includes a plate and a second encircled positioning portion disposed on the plate. When the heat dissipating member is disposed on the circuit board, the plate leans against the shielding frame and covers the chip, the second encircled positioning portion and the first encircled positioning portion correspond with each other in shape and position, so as to position the plate and the shielding frame. A shielding device is also disclosed. ## Claims ### Claim 1 A circuit board assembly, comprising: a circuit board; a shielding frame, fixed to and protruding from the circuit board, the shielding frame comprising a first encircled positioning portion that is away from the circuit board; a chip, disposed on the circuit board and located in the shielding frame; and a heat dissipating member, detachably disposed on the shielding frame, and comprising a plate and a second encircled positioning portion that is disposed on the plate, wherein when the heat dissipating member is disposed on the circuit board, the plate leans against the shielding frame and covers the chip, the second encircled positioning portion and the first encircled positioning portion correspond with each other in shape and position, so as to position the plate and the shielding frame. ### Claim 2 (depends on 1) The circuit board assembly as claimed in claim 1, wherein the second encircled positioning portion is an encircled groove, the first encircled positioning portion is an encircled protrusion that corresponds to the encircled groove. ### Claim 3 (depends on 2) The circuit board assembly as claimed in claim 2, wherein the first encircled positioning portion has a bent section in contact with a bottom wall of the encircled groove. ### Claim 4 (depends on 1) The circuit board assembly as claimed in claim 1, wherein the shielding frame is electrically connected to a ground terminal of the circuit board. ### Claim 5 (depends on 1) The circuit board assembly as claimed in claim 1, further comprising a plurality of fixing members, the heat dissipating member further comprising a plurality of through holes that are formed at a surrounding of the second encircled positioning portion, wherein the fixing members individually pass through the through holes, and are fixed to the circuit board and electrically connected to a ground terminal of the circuit board. ### Claim 6 A circuit board assembly, comprising: a circuit board; a shielding frame, fixed to and protruding from the circuit board; a chip, disposed on the circuit board and located in the shielding frame; and a heat dissipating member, detachably disposed on the shielding frame, wherein when the heat dissipating member is disposed on the circuit board, the heat dissipating member leans against the shielding frame and covers the chip, and the shielding frame overlaps the heat dissipating member at a junction in a radiation direction from a center of the chip. ### Claim 7 A shielding device, adapted to be disposed on a circuit board and cover a chip that is disposed on the circuit board, the shielding device comprising: a shielding frame, comprising a first encircled positioning portion; and a heat dissipating member, comprising a plate and a second encircled positioning portion that is disposed on the plate, wherein the second encircled positioning portion and the first encircled positioning portion correspond with each other in shape and position, so as to position the plate and the shielding frame, when the shielding device is disposed on the circuit board, an encircled abutting section of the shielding frame connected to the first encircled positioning portion leans against the circuit board, and the shielding frame and the heat dissipating member cooperatively cover the chip. ### Claim 8 (depends on 7) The shielding device as claimed in claim 7, wherein the second encircled positioning portion is an encircled groove, the first encircled positioning portion is an encircled protrusion that corresponds to the encircled groove. ### Claim 9 (depends on 7) The shielding device as claimed in claim 7, wherein the first encircled positioning portion has a bent section in contact with a bottom wall of the encircled groove. ### Claim 10 (depends on 7) The shielding device as claimed in claim 7, wherein the plate has a first surface and a second surface opposite the first surface, the second encircled positioning portion is located at the first surface, the heat dissipating member further comprise a plurality of fins located at the second surface.